Cadence Design Systems, Inc. announced that it has won four Open Innovation Platform(OIP) Partner of the Year awards from TSMC for its EDA and IP design solutions. 

Cadence was presented with awards for the joint development of the N2 and N3P design infrastructure, 3Dblox design prototyping solution, mmWave design solutions and DSP IP. 

The awards build upon the companies’ long-standing history of collaboration that has delivered many highly innovative SoC and advanced packaging design solutions to the global market.

“TSMC works continuously with our OIP design partners to enable technology advancements that make it faster and easier for customers to deliver competitive designs to market, simpler for customers to adopt our solutions,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. 

“Cadence’s commitment to design excellence is exemplary, and the TSMC OIP Partner of the Year awards are a testament to their dedication to ongoing innovation.”

“By continuing to collaborate closely with TSMC, we’re constantly energized by the innovations our customers bring to life using our technologies,” said Dr. Chin-Chi Teng, senior vice president and general manager of the Digital & Signoff Group at Cadence. 

“It’s an honor to be recognized with these prestigious TSMC awards, and they are a testament to the work we’ve done to enable our customers to achieve their design and time-to-market goals.”