▲ KIOXIA's new lineup of UFS Ver. 3.1 embedded flash memory devices is well-suited for mobile applications requiring high-performance with low power consumption.
KIOXIA America, Inc.(formerly Toshiba Memory America, Inc.), the U.S.-based subsidiary of KIOXIA Corporation, announced that it has started sampling Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices.

Well suited for mobile applications requiring high-performance with low power consumption, the new lineup utilizes KIOXIA’s cutting-edge BiCS FLASH 3D flash memory and is supported in four capacities: 128 gigabytes(GB), 256GB, 512GB, and 1 terabycte(TB).

The new devices integrate BiCS FLASH 3D flash memory and a controller in a JEDEC-standard 11.5 x 13mm package.

The controller performs error correction, wear leveling, logical-to-physical address translation, and bad-block management for simplified system development.

“KIOXIA was the first company to introduce UFS in 2013 and the first to offer UFS Ver. 3.0 last year, and we continue to be at the forefront of UFS memory with this Ver. 3.1 announcement today,” noted Scott Beekman, director of managed flash memory products for KIOXIA America, Inc.

“Our newest offerings enable next-gen mobile devices to take full advantage of the connectivity benefits of 5G, leading to faster downloads and reduced lag time – and an improved user experience.”

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