Ansys 2024 R2 redefines the boundaries of product design by enabling customers to move beyond the limits of single-physics simulation to gain multidimensional insight into the performance of today's complex products. 

R2 enhancements focused on accelerating run times, scaling capacity, enabling digital transformation, and providing hardware flexibility are making Ansys multiphysics simulations more accessible and powerful than ever before.

"Ansys 2024 R2 makes our portfolio deeper, broader, smarter, and more connected than it's ever been," said Shane Emswiler, senior vice president of products at Ansys. 

"Customers rely on Ansys software that spans the entire range of physics and domains, from systems simulation to digital twins. We look forward to the truly transformational innovations our customers will engineer with Ansys' pervasive simulation insights and the expertise of the Ansys Customer Excellence support team."

Ansys 2024 R2 streamlines multiphysics workflows, simplifying the process of connecting multiple, disparate software technologies across domains. 

The new release makes it easier for users to comprehensively evaluate cost and performance throughout a product's life cycle, from the most complex chips to electric vehicle powertrains.

Advanced packaging techniques for next-generation IC designs promise significant performance gains but increase design complexity. The new Ansys HFSS-IC solver addresses the growing complexity of today's advanced chip designs. 

Integrating Ansys' leading electronic and semiconductor technologies, the new HFSS-IC solver excels at deep electromagnetic analysis for IC signoff across power and signal integrity analysis — ensuring the final iteration delivers the performance demanded by next-generation electronic devices.

Increasingly complex multiphysics design challenges are permeating nearly every industry, including automotive. As companies seek to mature electric vehicle(EV) technology, optimizing noise, vibration, and harshness(NVH) in EV motors is crucial to vehicle performance and safety. 

Enhancements to Ansys Mechanical structural simulation software for e-powertrain workflows boost overall productivity of NVH analyses by delivering more accurate test correlation, acoustics simulation, and speed improvements.

This release also includes seamless data transfer between the Ansys Zemax optical system design software and the Ansys Speos optical performance analysis solver to more efficiently evaluate and optimize optical designs — including large systems with complex fields and wavelengths.

Ansys continues to deliver new use cases for AI, adding the Ansys TwinAI software to its portfolio. 

TwinAI software seamlessly combines insights from real-world data, powered by cutting-edge AI techniques, with the accuracy of multidomain models. This release also includes improvements to enable scaled deployments to the cloud or edge, allowing customers to unlock additional insights from real-world data.

The Ansys Missions AI + tool is a new technology that delivers algorithms focused on enhancing Ansys Digital Mission Engineering(DME) products. 

Engineers can automatically evaluate the quality of resulting orbit solutions with tuned models to provide expert-level analysis and enhanced safety of flight routines. Infusing AI into Ansys DME solutions allows users of varying simulation expertise to access and deploy the technology with ease.

Ansys AI integrations are also creating design efficiencies for nanometer-scale semiconductor applications. 

Ansys RaptorX electromagnetic modeling software now includes an AI-driven IC floorplan optimization solution, which identifies the ideal layout for mitigating electromagnetic coupling issues in analog and RF IC designs. By combining the power of the RaptorX solver with AI, users can reduce circuit footprint and shrink design time from weeks to days.